Description
Item Number
F16496
F16496
Description
HCU-MF050T Fiber
| Numerical Aperture | 0.2 |
|---|---|
| Attenuation | @ 1300 nm, ≤ 1.0, @ 850 nm, ≤ 2.8 (dB/km) |
| Core Diameter | 50 ± 3 (µm) |
| ETFE Buffer Diameter | 500 ± 30 (µm) |
| Core/Clad Offset | < 3 (µm) |
| Cladding Material | Silica |
| Buffer Material | ETFE |
| Operating Temperature | -65 to +125 (ºC) |
| Short-Term Bend Radius | > 10 (mm) |
| Long-Term Bend Radius | > 16 (mm) |
| Proof Test Level | 150 (kpsi) |
| Proof Test Level | 1.03 (GPa) |
| Typical Applications | Factory Automation, Short-to-Medium Distance Communications |
| Options | Buffer Color, Buffer Diameter, Cabling, Crimp & Cleave Connectorization, Proof Test |
| Type | Multimode Graded-Index |
| Cladding Diameter | 200 ± 4 (µm) |
| Coating Diameter | 230 +0/-10 (µm) |
| Coating Material | HCS® |
| Bandwidth | @ 1300 nm, ≥ 400, @ 850 nm, ≥ 400 (MHz-km) |
| Core/Coating Offset | < 5 (µm) |
